Circuits with high density can be obtained with techniques of Die-Assembly level and Wire-Bonding connections.

The design of these circuits also includes the characterization of the substrate stack that can be implemented on alumina, Teflon, Kapton, Mylar or thin FR4.

Examples of microcircuits are listed below:


  • stand-alone biomedical diagnostics systems
  • body implantable micro-sensors (human and animals)
  • radio transceivers microcircuits
  • multimedia microcircuits
  • micro-transponders


This type of circuit requires a careful research of the best solution for your application.

All aspects are directly managed and determined with the customer in order to evaluate the performance end.

In general, four aspects are considered fundamental functional.


Power Supply Source

In the case of battery power, can be deployed ad-hoc solutions possibly through the design of custom cells; in all other cases we exploit the commercial technologies of primary power battery.

For passive circuits are mainly exploited techniques RFID, NFC, thermal and piezo.


Substrate and Assembly Technology

The substrate can be rigid, flexible or mixed.

They can be made resistors, capacitors and other basic components with embedded technology.

Finally, the assembly of the chips can be implemented in multiple stack technique.


Integration and Functional Tests

Data la criticità intrinseca di questi dispositivi, tutte le fasi di integrazione e test vengono direttamente supportate e gestite direttamente con i fornitori dei servizi di montaggio.

Due to the intrinsic complexity of these devices, all phases of integration and testing are directly supported and managed in close collaboration with service providers mounting.


Firmware & Debug di sistema

In case of wireless microcircuits, are developed firmware and ad-hoc communication protocols in order to minimize the energy absorption.

The design concludes with functional testing of prototypes in all its parts, including all review activities and debugging in all levels.